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Yield Management - SysNav
CAD Navigation for Advanced Package Failure Analysis
SysNav™ is a layout visualizing and signal tracing CAD navigation software solution for printed circuit board (PCB), multi-chip module and stacked die applications. It extends Synopsys Avalon™ die-level failure analysis capabilities to the packaging industry. SysNav™ is the only commercially available tool able to integrate multiple, interactive IC and PCB designs with seamless CAD navigation capabilities. SysNav allows rapid signal traces on dies, stacked dies, multi-chip module and PCBs. Both Fab and Fabless teams can now trace a signal from chip to board, back to chip and then quickly navigate failure analysis tools to X, Y locations to determine the root cause of the failure.
SysNav™ is a part of the failure analysis product portfolio originally developed by Knights Technology. The Knights product line was acquired by Synopsys as part of its acquisition of Magma in 2012.
Benefits
- SysNav™ displays board-level layout data while Avalon’s MaskView™ displays chip or die-level layout data
- SysNav™ and MaskView allow interactive tracing or highlighting of the electrical connectivity
- SysNav™ and MaskView have similar GUIs for easy adoption
- SysNav™ provides many of Avalon’s board-level failure analysis capabilities, including 2D cross section and 3D view of selected small area
- Bookmark locations on package using KEdit and locate die information on board using DataLocator
- Perform Image overlay with automatic alignment capabilities
- Import net name info from Pin list file (ASCII File) or ODB++ database
- Convert package data using GUI based application, KDBBuilder
- Interface with Thermo Fisher ELITE System, FEI-V-Ion Plasma FIB and more
- Supports industry standard formats: ODB++, Gerber RS 274X, GDS and more
Figure 1: SysNav™ supports various configurations including TSV stacked-die and Wirebond